diff --git a/DayMiner.pretty/SON45P800X800X70-33T645X800N.kicad_mod b/DayMiner.pretty/SON45P800X800X70-33T645X800N.kicad_mod index b975752..0c8b670 100644 --- a/DayMiner.pretty/SON45P800X800X70-33T645X800N.kicad_mod +++ b/DayMiner.pretty/SON45P800X800X70-33T645X800N.kicad_mod @@ -1,7 +1,7 @@ (footprint "SON45P800X800X70-33T645X800N" (version 20211014) (generator pcbnew) (layer "F.Cu") (tedit 61E7326E) - (descr "32-SON (DFN), 0.45 mm pitch, 8.00 X 8.00 X 0.70 mm body, 8.00 X 6.45 mm thermal pad\r

32-pin SON (DFN) package with 0.45 mm pitch with body size 8.00 X 8.00 X 0.70 mm and thermal pad size 8.00 X 6.45 mm

") + (descr "32-SON (DFN), 0.48 mm pitch for BM1387") (fp_text reference "REF**" (at -4 -4.749) (layer "F.SilkS") (effects (font (size 0.747776 0.747776) (thickness 0.065024)) (justify left bottom)) (tstamp 7e1f52e5-10d6-4bf6-9ba1-c81f7ee3d516) @@ -12,130 +12,130 @@ ) (fp_poly (pts (xy 1.2 1) - (xy 2.9 1) - (xy 2.9 -1.3) + (xy 2.66 1) + (xy 2.66 -1.3) (xy 1.2 -1.3) ) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 35c5e8a0-f792-43d9-bc92-279929024ab9)) (fp_poly (pts - (xy -2.9 3.7) + (xy -2.66 3.7) (xy -1.2 3.7) (xy -1.2 1.4) - (xy -2.9 1.4) + (xy -2.66 1.4) ) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 36f88c04-3790-462a-b69e-19e81a80f8a8)) (fp_poly (pts - (xy -0.8 -2.3) - (xy 0.9 -2.3) - (xy 0.9 -3.7) - (xy -0.8 -3.7) + (xy -0.56 -2.3) + (xy 0.66 -2.3) + (xy 0.66 -3.7) + (xy -0.56 -3.7) ) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 41dbd212-3b7d-4d53-a549-be759b75e925)) (fp_poly (pts - (xy -0.8 3.7) - (xy 0.9 3.7) - (xy 0.9 1.4) - (xy -0.8 1.4) + (xy -0.56 3.7) + (xy 0.66 3.7) + (xy 0.66 1.4) + (xy -0.56 1.4) ) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 66ad77fe-d998-4731-a3c8-f968fc850795)) (fp_poly (pts (xy 1.2 3.7) - (xy 2.9 3.7) - (xy 2.9 1.4) + (xy 2.66 3.7) + (xy 2.66 1.4) (xy 1.2 1.4) ) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 6c04a4c3-edac-4601-aa7a-b28a137fb8fd)) (fp_poly (pts - (xy -0.8 1) - (xy 0.9 1) - (xy 0.9 -1.3) - (xy -0.8 -1.3) + (xy -0.56 1) + (xy 0.66 1) + (xy 0.66 -1.3) + (xy -0.56 -1.3) ) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 6fc8ad3a-675e-4948-a8d0-29993619ec44)) (fp_poly (pts (xy 1.2 -2.3) - (xy 2.9 -2.3) - (xy 2.9 -3.7) + (xy 2.66 -2.3) + (xy 2.66 -3.7) (xy 1.2 -3.7) ) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 74215b87-148f-412c-b93d-17979b7efadc)) (fp_poly (pts - (xy -2.9 1) + (xy -2.66 1) (xy -1.2 1) (xy -1.2 -1.3) - (xy -2.9 -1.3) + (xy -2.66 -1.3) ) (layer "F.Paste") (width 0.1) (fill solid) (tstamp bd9343b9-a9e6-40f3-81ba-38aac3d03e55)) (fp_poly (pts - (xy -2.9 -2.3) + (xy -2.66 -2.3) (xy -1.2 -2.3) (xy -1.2 -3.7) - (xy -2.9 -3.7) + (xy -2.66 -3.7) ) (layer "F.Paste") (width 0.1) (fill solid) (tstamp d50e7610-8609-466f-ad92-b1ff924db599)) (fp_line (start -4.05 -4.05) (end 4.05 -4.05) (layer "F.SilkS") (width 0.12) (tstamp 3aeb291e-5959-47ef-834f-cbc4eadf37fd)) (fp_line (start -4.05 4.05) (end -4.05 -4.05) (layer "F.SilkS") (width 0.12) (tstamp 4ba6daae-ad34-434f-8175-dec7691470a0)) (fp_line (start 4.05 -4.05) (end 4.05 4.05) (layer "F.SilkS") (width 0.12) (tstamp 9b0b0991-43f8-4a63-8407-2252799cd1f1)) (fp_line (start 4.05 4.05) (end -4.05 4.05) (layer "F.SilkS") (width 0.12) (tstamp c4f2c43f-9305-4680-b4dd-c2f07079ce78)) (fp_circle (center -4.554 -4.014) (end -4.429 -4.014) (layer "F.SilkS") (width 0.25) (fill none) (tstamp 6c06e473-bf46-4ed1-badf-3d60a4d08c69)) - (pad "1" smd roundrect (at -3.9346 -3.375) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "1" smd roundrect (at -3.9346 -3.6) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp cbf3e96f-50b3-414f-9104-2d9648646867)) - (pad "2" smd roundrect (at -3.9346 -2.925) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "2" smd roundrect (at -3.9346 -3.12) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp c2b5af92-dce6-45e2-ab43-e70597c80ada)) - (pad "3" smd roundrect (at -3.9346 -2.475) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "3" smd roundrect (at -3.9346 -2.64) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 12f49ceb-d62c-4da0-9e73-d150557de5c1)) - (pad "4" smd roundrect (at -3.9346 -2.025) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "4" smd roundrect (at -3.9346 -2.16) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 036bc9e5-5017-404b-94d6-f0ef16cbbbbe)) - (pad "5" smd roundrect (at -3.9346 -1.575) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "5" smd roundrect (at -3.9346 -1.68) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp f4c52bb9-85f0-4abf-82ab-e191beba7e75)) - (pad "6" smd roundrect (at -3.9346 -1.125) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "6" smd roundrect (at -3.9346 -1.2) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 86482fed-11e9-40b4-8b3c-60f87f8bb99a)) - (pad "7" smd roundrect (at -3.9346 -0.675) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "7" smd roundrect (at -3.9346 -0.72) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 894ae74f-cf19-48a8-91d0-c62479ded74e)) - (pad "8" smd roundrect (at -3.9346 -0.225) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "8" smd roundrect (at -3.9346 -0.24) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp f51337fe-a8ee-4c90-b003-913ba4ddeb33)) - (pad "9" smd roundrect (at -3.9346 0.225) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "9" smd roundrect (at -3.9346 0.24) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp c21e124b-638d-454e-9883-afad42e4b989)) - (pad "10" smd roundrect (at -3.9346 0.675) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "10" smd roundrect (at -3.9346 0.72) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp a12994b3-ea59-4cf4-95d9-f6afc921ef67)) - (pad "11" smd roundrect (at -3.9346 1.125) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "11" smd roundrect (at -3.9346 1.2) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 2ba198f9-5e48-46c0-8b2e-c9eb50759653)) - (pad "12" smd roundrect (at -3.9346 1.575) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "12" smd roundrect (at -3.9346 1.68) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp c0d31616-3520-4602-a83d-0ec828ead7e6)) - (pad "13" smd roundrect (at -3.9346 2.025) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "13" smd roundrect (at -3.9346 2.16) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 7e0c3c01-fdcb-4458-aa3c-fc424b216d5b)) - (pad "14" smd roundrect (at -3.9346 2.475) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "14" smd roundrect (at -3.9346 2.64) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 1eaacd4b-acf5-4ec1-8469-6fac857aa495)) - (pad "15" smd roundrect (at -3.9346 2.925) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "15" smd roundrect (at -3.9346 3.12) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp afc40f8e-5121-40a4-8c9b-fe97feb53378)) - (pad "16" smd roundrect (at -3.9346 3.375) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "16" smd roundrect (at -3.9346 3.6) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp d0a0c10d-f652-4e98-a2ad-bc99a059e41f)) - (pad "17" smd roundrect (at 3.9346 3.375) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "17" smd roundrect (at 3.9346 3.6) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 0197074e-9f73-4b13-a717-c11a979bd6d9)) - (pad "18" smd roundrect (at 3.9346 2.925) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "18" smd roundrect (at 3.9346 3.12) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 4e46c147-2c3a-44a5-8204-27d0a066b51c)) - (pad "19" smd roundrect (at 3.9346 2.475) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "19" smd roundrect (at 3.9346 2.64) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 87ad0cc7-dda3-4e17-a4c0-bd1cf9eb5f59)) - (pad "20" smd roundrect (at 3.9346 2.025) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "20" smd roundrect (at 3.9346 2.16) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 26181173-6a29-4509-931c-d16743eb2156)) - (pad "21" smd roundrect (at 3.9346 1.575) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "21" smd roundrect (at 3.9346 1.68) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 0524870f-2e00-4bac-802c-5de1c031ffb4)) - (pad "22" smd roundrect (at 3.9346 1.125) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "22" smd roundrect (at 3.9346 1.2) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 26286856-cbec-4a20-9f05-47ee30578f0e)) - (pad "23" smd roundrect (at 3.9346 0.675) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "23" smd roundrect (at 3.9346 0.72) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp d5173407-c8de-4c71-a055-02e5bfb8b7f9)) - (pad "24" smd roundrect (at 3.9346 0.225) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "24" smd roundrect (at 3.9346 0.24) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp baccaccf-1360-420a-b34b-169874f9a120)) - (pad "25" smd roundrect (at 3.9346 -0.225) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "25" smd roundrect (at 3.9346 -0.24) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp ec7f25f4-0c5d-4413-bb3b-f181405f3255)) - (pad "26" smd roundrect (at 3.9346 -0.675) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "26" smd roundrect (at 3.9346 -0.72) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 8e571bb0-dfe7-4645-b577-607a3edcd57f)) - (pad "27" smd roundrect (at 3.9346 -1.125) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "27" smd roundrect (at 3.9346 -1.2) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 45e57153-386a-4ca4-9e99-ece5b0c78caf)) - (pad "28" smd roundrect (at 3.9346 -1.575) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "28" smd roundrect (at 3.9346 -1.68) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 421dc351-63c2-4090-9124-8be676ac2841)) - (pad "29" smd roundrect (at 3.9346 -2.025) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "29" smd roundrect (at 3.9346 -2.16) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 85a5d77a-6f3c-4799-9b4f-426c247fed95)) - (pad "30" smd roundrect (at 3.9346 -2.475) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "30" smd roundrect (at 3.9346 -2.64) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 83bee4c8-c376-4d03-8e36-90b1762e04cd)) - (pad "31" smd roundrect (at 3.9346 -2.925) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "31" smd roundrect (at 3.9346 -3.12) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 73ad73e0-6674-4fdc-b9fc-2ae33667c3bd)) - (pad "32" smd roundrect (at 3.9346 -3.375) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) + (pad "32" smd roundrect (at 3.9346 -3.6) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5) (solder_mask_margin 0.1016) (tstamp 091b6122-907c-43fe-a6ee-fe9aa19c7120)) - (pad "33" smd rect (at 0 -3) (size 6.45 1.85) (layers "F.Cu" "F.Mask") + (pad "33" smd rect (at 0 -3) (size 6.3 1.85) (layers "F.Cu" "F.Mask") (solder_mask_margin 0.1016) (zone_connect 2) (tstamp 7e84605e-c1ba-4298-a35b-76e8fa9768fa)) - (pad "34" smd rect (at 0 1.2) (size 6.45 5.55) (layers "F.Cu" "F.Mask") + (pad "34" smd rect (at 0 1.2) (size 6.3 5.55) (layers "F.Cu" "F.Mask") (solder_mask_margin 0.1016) (zone_connect 2) (tstamp 407ce006-bea9-483e-8673-aae42b3d8073)) (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-44-1EP_8x8mm_P0.65mm_EP6.6x6.6mm.step" (offset (xyz 0 0 0)) diff --git a/bitaxe.kicad_pcb b/bitaxe.kicad_pcb index 1cea05f..a78c05c 100644 --- a/bitaxe.kicad_pcb +++ b/bitaxe.kicad_pcb @@ -2863,7 +2863,7 @@ (footprint "Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical" (layer "F.Cu") (tedit 59FED5CC) (tstamp bef2bc59-d126-474f-9f67-5c90f5be42f4) - (at 87.99 52.78 90) + (at 84.815 53.034 90) (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row") (tags "Through hole pin header THT 1x02 2.54mm single row") (property "DNP" "T") @@ -4320,145 +4320,145 @@ (footprint "DayMiner:SON45P800X800X70-33T645X800N" (layer "B.Cu") (tedit 61E7326E) (tstamp 6929418f-130d-47a2-89ae-f701bf9ebd12) (at 89.29 67.65 180) - (descr "32-SON (DFN), 0.45 mm pitch, 8.00 X 8.00 X 0.70 mm body, 8.00 X 6.45 mm thermal pad\r

32-pin SON (DFN) package with 0.45 mm pitch with body size 8.00 X 8.00 X 0.70 mm and thermal pad size 8.00 X 6.45 mm

") + (descr "32-SON (DFN), 0.48 mm pitch for BM1387") (property "Sheetfile" "bitaxe.kicad_sch") (property "Sheetname" "") (path "/d74caccd-c49f-4c08-9224-492e6f0778d1") (fp_text reference "IC1" (at -4.25 4.51) (layer "B.SilkS") (effects (font (size 1 1) (thickness 0.15)) (justify left bottom mirror)) - (tstamp aa80c5ea-3c4a-4a36-a2ae-3269b744a85e) + (tstamp 534c1bb9-c4ae-4e1e-8aab-bb00cdc42e92) ) (fp_text value "BM1387" (at -3.6 -5.549) (layer "B.Fab") (effects (font (size 0.747776 0.747776) (thickness 0.065024)) (justify left bottom mirror)) - (tstamp 8a3c2c9d-370f-4fd7-9336-82ba3a6e2b5e) + (tstamp ffe5315a-c41d-440b-9769-f84f3f6e43bc) ) (fp_poly (pts - (xy 1.2 -3.7) - (xy 2.9 -3.7) - (xy 2.9 -1.4) - (xy 1.2 -1.4) - ) (layer "B.Paste") (width 0.1) (fill solid) (tstamp 090216cf-f117-439c-a610-c043a0fbdae7)) + (xy -0.56 -1) + (xy 0.66 -1) + (xy 0.66 1.3) + (xy -0.56 1.3) + ) (layer "B.Paste") (width 0.1) (fill solid) (tstamp 67320b5e-d3a4-4597-90b7-566269db7636)) (fp_poly (pts - (xy 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32-pin SON (DFN) package with 0.45 mm pitch with body size 8.00 X 8.00 X 0.70 mm and thermal pad size 8.00 X 6.45 mm

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