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all footprints should be added now

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Skot Croshere
2022-11-22 16:27:10 -05:00
parent da6a1bd9f2
commit 437ff0e99c
6 changed files with 349 additions and 112 deletions
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145
bitaxe.pretty/BM1397.kicad_mod Normal file
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@@ -0,0 +1,145 @@
(footprint "BM1397" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 61E7326E)
(descr "32-SON (DFN), 0.48 mm pitch for BM1387")
(fp_text reference "REF**" (at -4 -4.749) (layer "F.SilkS")
(effects (font (size 0.747776 0.747776) (thickness 0.065024)) (justify left bottom))
(tstamp 7e1f52e5-10d6-4bf6-9ba1-c81f7ee3d516)
)
(fp_text value ">VALUE" (at -3.6 5.549) (layer "F.Fab")
(effects (font (size 0.747776 0.747776) (thickness 0.065024)) (justify left bottom))
(tstamp ded160a2-8af3-472d-be4f-2247c3e0f876)
)
(fp_poly (pts
(xy 1.2 1)
(xy 2.66 1)
(xy 2.66 -1.3)
(xy 1.2 -1.3)
) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 35c5e8a0-f792-43d9-bc92-279929024ab9))
(fp_poly (pts
(xy -2.66 3.7)
(xy -1.2 3.7)
(xy -1.2 1.4)
(xy -2.66 1.4)
) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 36f88c04-3790-462a-b69e-19e81a80f8a8))
(fp_poly (pts
(xy -0.56 -2.3)
(xy 0.66 -2.3)
(xy 0.66 -3.7)
(xy -0.56 -3.7)
) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 41dbd212-3b7d-4d53-a549-be759b75e925))
(fp_poly (pts
(xy -0.56 3.7)
(xy 0.66 3.7)
(xy 0.66 1.4)
(xy -0.56 1.4)
) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 66ad77fe-d998-4731-a3c8-f968fc850795))
(fp_poly (pts
(xy 1.2 3.7)
(xy 2.66 3.7)
(xy 2.66 1.4)
(xy 1.2 1.4)
) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 6c04a4c3-edac-4601-aa7a-b28a137fb8fd))
(fp_poly (pts
(xy -0.56 1)
(xy 0.66 1)
(xy 0.66 -1.3)
(xy -0.56 -1.3)
) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 6fc8ad3a-675e-4948-a8d0-29993619ec44))
(fp_poly (pts
(xy 1.2 -2.3)
(xy 2.66 -2.3)
(xy 2.66 -3.7)
(xy 1.2 -3.7)
) (layer "F.Paste") (width 0.1) (fill solid) (tstamp 74215b87-148f-412c-b93d-17979b7efadc))
(fp_poly (pts
(xy -2.66 1)
(xy -1.2 1)
(xy -1.2 -1.3)
(xy -2.66 -1.3)
) (layer "F.Paste") (width 0.1) (fill solid) (tstamp bd9343b9-a9e6-40f3-81ba-38aac3d03e55))
(fp_poly (pts
(xy -2.66 -2.3)
(xy -1.2 -2.3)
(xy -1.2 -3.7)
(xy -2.66 -3.7)
) (layer "F.Paste") (width 0.1) (fill solid) (tstamp d50e7610-8609-466f-ad92-b1ff924db599))
(fp_line (start -4.05 -4.05) (end 4.05 -4.05) (layer "F.SilkS") (width 0.12) (tstamp 3aeb291e-5959-47ef-834f-cbc4eadf37fd))
(fp_line (start -4.05 4.05) (end -4.05 -4.05) (layer "F.SilkS") (width 0.12) (tstamp 4ba6daae-ad34-434f-8175-dec7691470a0))
(fp_line (start 4.05 -4.05) (end 4.05 4.05) (layer "F.SilkS") (width 0.12) (tstamp 9b0b0991-43f8-4a63-8407-2252799cd1f1))
(fp_line (start 4.05 4.05) (end -4.05 4.05) (layer "F.SilkS") (width 0.12) (tstamp c4f2c43f-9305-4680-b4dd-c2f07079ce78))
(fp_circle (center -4.554 -4.014) (end -4.429 -4.014) (layer "F.SilkS") (width 0.25) (fill none) (tstamp 6c06e473-bf46-4ed1-badf-3d60a4d08c69))
(pad "1" smd roundrect (at -3.9346 -3.6) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp cbf3e96f-50b3-414f-9104-2d9648646867))
(pad "2" smd roundrect (at -3.9346 -3.12) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp c2b5af92-dce6-45e2-ab43-e70597c80ada))
(pad "3" smd roundrect (at -3.9346 -2.64) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 12f49ceb-d62c-4da0-9e73-d150557de5c1))
(pad "4" smd roundrect (at -3.9346 -2.16) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 036bc9e5-5017-404b-94d6-f0ef16cbbbbe))
(pad "5" smd roundrect (at -3.9346 -1.68) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp f4c52bb9-85f0-4abf-82ab-e191beba7e75))
(pad "6" smd roundrect (at -3.9346 -1.2) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 86482fed-11e9-40b4-8b3c-60f87f8bb99a))
(pad "7" smd roundrect (at -3.9346 -0.72) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 894ae74f-cf19-48a8-91d0-c62479ded74e))
(pad "8" smd roundrect (at -3.9346 -0.24) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp f51337fe-a8ee-4c90-b003-913ba4ddeb33))
(pad "9" smd roundrect (at -3.9346 0.24) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp c21e124b-638d-454e-9883-afad42e4b989))
(pad "10" smd roundrect (at -3.9346 0.72) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp a12994b3-ea59-4cf4-95d9-f6afc921ef67))
(pad "11" smd roundrect (at -3.9346 1.2) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 2ba198f9-5e48-46c0-8b2e-c9eb50759653))
(pad "12" smd roundrect (at -3.9346 1.68) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp c0d31616-3520-4602-a83d-0ec828ead7e6))
(pad "13" smd roundrect (at -3.9346 2.16) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 7e0c3c01-fdcb-4458-aa3c-fc424b216d5b))
(pad "14" smd roundrect (at -3.9346 2.64) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 1eaacd4b-acf5-4ec1-8469-6fac857aa495))
(pad "15" smd roundrect (at -3.9346 3.12) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp afc40f8e-5121-40a4-8c9b-fe97feb53378))
(pad "16" smd roundrect (at -3.9346 3.6) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp d0a0c10d-f652-4e98-a2ad-bc99a059e41f))
(pad "17" smd roundrect (at 3.9346 3.6) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 0197074e-9f73-4b13-a717-c11a979bd6d9))
(pad "18" smd roundrect (at 3.9346 3.12) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 4e46c147-2c3a-44a5-8204-27d0a066b51c))
(pad "19" smd roundrect (at 3.9346 2.64) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 87ad0cc7-dda3-4e17-a4c0-bd1cf9eb5f59))
(pad "20" smd roundrect (at 3.9346 2.16) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 26181173-6a29-4509-931c-d16743eb2156))
(pad "21" smd roundrect (at 3.9346 1.68) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 0524870f-2e00-4bac-802c-5de1c031ffb4))
(pad "22" smd roundrect (at 3.9346 1.2) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 26286856-cbec-4a20-9f05-47ee30578f0e))
(pad "23" smd roundrect (at 3.9346 0.72) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp d5173407-c8de-4c71-a055-02e5bfb8b7f9))
(pad "24" smd roundrect (at 3.9346 0.24) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp baccaccf-1360-420a-b34b-169874f9a120))
(pad "25" smd roundrect (at 3.9346 -0.24) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp ec7f25f4-0c5d-4413-bb3b-f181405f3255))
(pad "26" smd roundrect (at 3.9346 -0.72) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 8e571bb0-dfe7-4645-b577-607a3edcd57f))
(pad "27" smd roundrect (at 3.9346 -1.2) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 45e57153-386a-4ca4-9e99-ece5b0c78caf))
(pad "28" smd roundrect (at 3.9346 -1.68) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 421dc351-63c2-4090-9124-8be676ac2841))
(pad "29" smd roundrect (at 3.9346 -2.16) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 85a5d77a-6f3c-4799-9b4f-426c247fed95))
(pad "30" smd roundrect (at 3.9346 -2.64) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 83bee4c8-c376-4d03-8e36-90b1762e04cd))
(pad "31" smd roundrect (at 3.9346 -3.12) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 73ad73e0-6674-4fdc-b9fc-2ae33667c3bd))
(pad "32" smd roundrect (at 3.9346 -3.6) (size 0.86 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (tstamp 091b6122-907c-43fe-a6ee-fe9aa19c7120))
(pad "33" smd rect (at 0 -3) (size 6.3 1.85) (layers "F.Cu" "F.Mask")
(solder_mask_margin 0.1016) (zone_connect 2) (tstamp 7e84605e-c1ba-4298-a35b-76e8fa9768fa))
(pad "34" smd rect (at 0 1.2) (size 6.3 5.55) (layers "F.Cu" "F.Mask")
(solder_mask_margin 0.1016) (zone_connect 2) (tstamp 407ce006-bea9-483e-8673-aae42b3d8073))
(model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-44-1EP_8x8mm_P0.65mm_EP6.6x6.6mm.step"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

23
bitaxe.pretty/O 25,0-JO32-B-1V3-1-T1-LF.kicad_mod Normal file
View File

@@ -0,0 +1,23 @@
(footprint "O 25,0-JO32-B-1V3-1-T1-LF" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 62B54E45)
(attr smd)
(fp_text reference "REF**" (at -0.03 -2.43 unlocked) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp c1344181-1d9e-48c4-b279-ab0e274e51f6)
)
(fp_text value "O 25,0-JO32-B-1V3-1-T1-LF" (at 0.65 -4.29 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp c358d6d3-3fc1-4255-889b-dd8456b5bf5d)
)
(fp_text user "${REFERENCE}" (at 5.36 -2.32 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp b0901133-9ac8-4fae-b1c3-23a5c59648f4)
)
(fp_rect (start -1.6 -1.25) (end 1.6 1.25) (layer "F.SilkS") (width 0.12) (fill none) (tstamp c0bfe341-0704-4ff2-8859-063ac6ebe620))
(fp_circle (center -1.76 2.01) (end -1.50682 2.01) (layer "F.SilkS") (width 0.12) (fill solid) (tstamp ba3bb3ff-9a2f-4de5-ba97-3a9491ea9505))
(pad "1" smd rect (at -1.15 0.95) (size 1.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 93b86c17-095d-4de5-a8b5-bb4c5838f14a))
(pad "2" smd rect (at 1.15 0.95) (size 1.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 88e91ce6-fb03-412f-bf07-e802e71fbec8))
(pad "3" smd rect (at 1.15 -0.95) (size 1.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c6a3a4f6-9b75-4503-9dc6-464cb8856679))
(pad "4" smd rect (at -1.15 -0.95) (size 1.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 866b60bb-219c-4f75-a5a8-c4750dbe70c9))
)

271
bitaxeMax.kicad_pcb
View File

@@ -194,6 +194,7 @@
(net 98 "unconnected-(U12-Pad37)") (net 98 "unconnected-(U12-Pad37)")
(net 99 "unconnected-(U12-Pad38)") (net 99 "unconnected-(U12-Pad38)")
(net 100 "unconnected-(U12-Pad39)") (net 100 "unconnected-(U12-Pad39)")
(net 101 "/Power/OUT1")
(footprint "Capacitor_SMD:C_0805_2012Metric" (layer "F.Cu") (footprint "Capacitor_SMD:C_0805_2012Metric" (layer "F.Cu")
(tedit 5F68FEEE) (tstamp 00fa52e7-d6a1-499e-95bb-53c886d9bc7c) (tedit 5F68FEEE) (tstamp 00fa52e7-d6a1-499e-95bb-53c886d9bc7c)
@@ -2854,6 +2855,68 @@
) )
) )
(footprint "Package_SO:TSSOP-8_3x3mm_P0.65mm" (layer "F.Cu")
(tedit 5A02F25C) (tstamp 810d20e3-e882-48e6-9a72-c64bcd1f7dd4)
(at 197.44 75.41)
(descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)")
(tags "SSOP 0.65")
(property "DK" "DS4432U+-ND")
(property "PARTNO" "DS4432U+")
(property "Sheetfile" "File: power.kicad_sch")
(property "Sheetname" "Power")
(path "/8ec0a9c6-2b78-44ef-a83d-9047d2828409/3bb37263-3b43-4f43-bba6-c0ec681def98")
(attr smd)
(fp_text reference "U10" (at 0 -2.55) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp b87bccbb-0c3a-4b67-98f1-22f4221888ea)
)
(fp_text value "DS4432U+" (at 0 2.55) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 4cd5b8de-282a-4e9f-9dbe-5fd045650f86)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.6 0.6) (thickness 0.15)))
(tstamp 8d000603-cebc-4bae-98b9-c3f91cb2a47d)
)
(fp_line (start -1.625 1.625) (end -1.625 1.4) (layer "F.SilkS") (width 0.15) (tstamp 192aab92-058a-4d8f-be42-9c8c8d1ed5a7))
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer "F.SilkS") (width 0.15) (tstamp 2f8e91fc-e933-4ecf-96e1-63da04183447))
(fp_line (start 1.625 1.625) (end 1.625 1.4) (layer "F.SilkS") (width 0.15) (tstamp 2fcc9721-dc1a-4f48-b674-02ab79100698))
(fp_line (start -1.625 -1.625) (end -1.625 -1.5) (layer "F.SilkS") (width 0.15) (tstamp 3c90faa5-5ddc-4954-a1e8-c44811f9f0c9))
(fp_line (start 1.625 -1.625) (end 1.625 -1.4) (layer "F.SilkS") (width 0.15) (tstamp 9c55d493-6fd2-424b-8dd8-c797b8a2e143))
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer "F.SilkS") (width 0.15) (tstamp b5e63504-c4b0-4788-bbd5-9f3d6914d92a))
(fp_line (start -1.625 -1.5) (end -2.7 -1.5) (layer "F.SilkS") (width 0.15) (tstamp f0634318-7095-401c-b5b3-77b22f9105d6))
(fp_line (start 2.95 -1.8) (end 2.95 1.8) (layer "F.CrtYd") (width 0.05) (tstamp 56ded4b5-0a75-4928-8099-50cb9df9d5cd))
(fp_line (start -2.95 -1.8) (end -2.95 1.8) (layer "F.CrtYd") (width 0.05) (tstamp 6790cfda-aea8-435b-ab98-6a3c14b05958))
(fp_line (start -2.95 1.8) (end 2.95 1.8) (layer "F.CrtYd") (width 0.05) (tstamp 71084f13-d7c6-4023-b9f6-4656aaf0fb2a))
(fp_line (start -2.95 -1.8) (end 2.95 -1.8) (layer "F.CrtYd") (width 0.05) (tstamp f81b538b-7608-4ef2-a3a5-cefbf9d56514))
(fp_line (start -0.5 -1.5) (end 1.5 -1.5) (layer "F.Fab") (width 0.15) (tstamp 2999d6de-ba82-4d9b-b19c-33df5b24a37a))
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer "F.Fab") (width 0.15) (tstamp 69c53588-8528-4de0-ae4f-6f49266e272f))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer "F.Fab") (width 0.15) (tstamp 78a359d8-31a4-4902-a4d4-d917b6cbdc1d))
(fp_line (start -1.5 1.5) (end -1.5 -0.5) (layer "F.Fab") (width 0.15) (tstamp 99503944-55fc-4c6b-911b-a950a7cffaab))
(fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer "F.Fab") (width 0.15) (tstamp fa0e0104-c582-4df5-a768-53b72a2aa024))
(pad "1" smd rect (at -2.15 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(net 20 "/SDA") (pinfunction "SDA") (pintype "input") (tstamp 9231a8f3-1ab4-4d4b-9d0d-797acb39463f))
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(net 58 "Net-(R17-Pad1)") (pinfunction "FS1") (pintype "input") (tstamp f2666492-d8b1-47a2-9fc7-cc995b39368a))
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(net 1 "GND") (pinfunction "GND") (pintype "power_in") (tstamp 429b350f-adaf-42bf-bd98-9e0861b58149))
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(net 57 "Net-(R16-Pad1)") (pinfunction "FS0") (pintype "input") (tstamp 3c6768d5-60e2-4304-b2f6-6acc4437f171))
(pad "6" smd rect (at 2.15 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(net 21 "/Power/OUT0") (pinfunction "OUT0") (pintype "output") (tstamp 4d460ed9-c9a7-4e52-8198-7193f7ffd5ce))
(pad "7" smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(net 101 "/Power/OUT1") (pinfunction "OUT1") (pintype "output") (tstamp c719ab4f-20a9-431b-9655-0f645f2bd0f8))
(pad "8" smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(net 3 "/Power/VIN") (pinfunction "VCC") (pintype "power_in") (tstamp a47cd60f-abd6-4588-9b43-0c045ccf18e4))
(model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-8_3x3mm_P0.65mm.wrl"
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(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
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)
(footprint "Capacitor_SMD:C_0402_1005Metric" (layer "F.Cu") (footprint "Capacitor_SMD:C_0402_1005Metric" (layer "F.Cu")
(tedit 5F68FEEE) (tstamp 8508a4d4-fdd2-4f5d-8fe2-1ae9a84e0c09) (tedit 5F68FEEE) (tstamp 8508a4d4-fdd2-4f5d-8fe2-1ae9a84e0c09)
(at 237.491256 83.083157) (at 237.491256 83.083157)
@@ -4302,7 +4365,7 @@
(net 19 "/SCL") (pinfunction "1") (pintype "passive") (tstamp ad75fa2a-77e6-4d99-9976-7a5d7a0e6a5a)) (net 19 "/SCL") (pinfunction "1") (pintype "passive") (tstamp ad75fa2a-77e6-4d99-9976-7a5d7a0e6a5a))
) )
(footprint "DayMiner:O 25,0-JO32-B-1V3-1-T1-LF" (layer "F.Cu") (footprint "bitaxe:O 25,0-JO32-B-1V3-1-T1-LF" (layer "F.Cu")
(tedit 62B54E45) (tstamp c90a04e6-a08a-4b26-ab17-803d14ff84fe) (tedit 62B54E45) (tstamp c90a04e6-a08a-4b26-ab17-803d14ff84fe)
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@@ -4311,28 +4374,28 @@
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@@ -5527,148 +5590,148 @@
) )
) )
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(descr "32-SON (DFN), 0.48 mm pitch for BM1387") (descr "32-SON (DFN), 0.48 mm pitch for BM1387")
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(net 42 "Net-(IC1-Pad6)") (pinfunction "ADDR2") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp a75ce84b-7160-4068-8235-53eb5a765b6f)) (net 42 "Net-(IC1-Pad6)") (pinfunction "ADDR2") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 7c32d7dc-da25-40d3-9734-dcd6b288b0f7))
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(net 43 "unconnected-(IC1-Pad7)") (pinfunction "TEST") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 115fa82d-778f-409f-86d6-019d37f5fb50)) (net 43 "unconnected-(IC1-Pad7)") (pinfunction "TEST") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 5cf05797-f873-4410-83c9-818904a162a0))
(pad "8" smd roundrect (at -3.9346 0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "8" smd roundrect (at -3.9346 0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 44 "Net-(IC1-Pad8)") (pinfunction "BI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp b32a67d7-18b0-466b-ae9f-8890e6fc8ecf)) (net 44 "Net-(IC1-Pad8)") (pinfunction "BI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp dbbf557e-bf02-4114-a0a0-256531b4a11f))
(pad "9" smd roundrect (at -3.9346 -0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "9" smd roundrect (at -3.9346 -0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 7 "/RST_N") (pinfunction "NRSTI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp ce0ea0a0-efad-4384-931e-0b086212734e)) (net 7 "/RST_N") (pinfunction "NRSTI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 830c14b0-f7fa-4cef-8e54-baa1ecb60628))
(pad "10" smd roundrect (at -3.9346 -0.72 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "10" smd roundrect (at -3.9346 -0.72 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 45 "Net-(IC1-Pad10)") (pinfunction "RO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp f35bef0c-9867-4f08-878a-bf791c249b90)) (net 45 "Net-(IC1-Pad10)") (pinfunction "RO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 2d7dc198-7ad7-4954-80c6-a4efacb1ab73))
(pad "11" smd roundrect (at -3.9346 -1.2 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "11" smd roundrect (at -3.9346 -1.2 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 46 "Net-(IC1-Pad11)") (pinfunction "CI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp aa79f56d-78e5-449f-8a38-735775b4d72f)) (net 46 "Net-(IC1-Pad11)") (pinfunction "CI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 2a9ad6f2-cf26-47d4-bfd5-902b293aaa83))
(pad "12" smd roundrect (at -3.9346 -1.68 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "12" smd roundrect (at -3.9346 -1.68 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 47 "Net-(IC1-Pad12)") (pinfunction "CLKI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp cff385e7-06ea-4b0c-adc2-cc5bcc971740)) (net 47 "Net-(IC1-Pad12)") (pinfunction "CLKI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp dc6dc5f6-03cd-49aa-ba1a-b1b67ffb6b3a))
(pad "13" smd roundrect (at -3.9346 -2.16 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "13" smd roundrect (at -3.9346 -2.16 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 1 "GND") (pinfunction "PLL_VSS") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 991b9f0b-e720-4ba6-bce7-2d0ece60b6e0)) (net 1 "GND") (pinfunction "PLL_VSS") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 2a874d77-edc9-4677-b5a2-2edbf1f67888))
(pad "14" smd roundrect (at -3.9346 -2.64 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "14" smd roundrect (at -3.9346 -2.64 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 13 "/0V8") (pinfunction "PLL_VDD") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 8d70e2ab-9a3c-4ed4-88ed-f2d965e5ec5b)) (net 13 "/0V8") (pinfunction "PLL_VDD") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp fc379ba2-cd7f-4614-89d0-795634255766))
(pad "15" smd roundrect (at -3.9346 -3.12 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "15" smd roundrect (at -3.9346 -3.12 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 13 "/0V8") (pinfunction "VDDIO_08_0") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 06f9e770-0774-4b22-865a-f7a5e9a3bc69)) (net 13 "/0V8") (pinfunction "VDDIO_08_0") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 73ef1c5b-e458-482b-8f56-56f5982282ac))
(pad "16" smd roundrect (at -3.9346 -3.6 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "16" smd roundrect (at -3.9346 -3.6 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 12 "/1V8") (pinfunction "VDDIO_18_0") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 30b74be1-82ed-4f5c-90d7-fa3f3a93907d)) (net 12 "/1V8") (pinfunction "VDDIO_18_0") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 7a4cbb88-a213-48f9-a5aa-beed162e07ea))
(pad "17" smd roundrect (at 3.9346 -3.6 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "17" smd roundrect (at 3.9346 -3.6 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 12 "/1V8") (pinfunction "VDDIO_18_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 4b47a665-c28b-4a89-af98-06b6c674b365)) (net 12 "/1V8") (pinfunction "VDDIO_18_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 0bfc38ae-7f2c-4de5-aa38-9d65be956498))
(pad "18" smd roundrect (at 3.9346 -3.12 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "18" smd roundrect (at 3.9346 -3.12 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 13 "/0V8") (pinfunction "VDDIO_08_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp e3d53663-8b93-4430-b999-c7baee9b11fe)) (net 13 "/0V8") (pinfunction "VDDIO_08_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 01284d2a-8497-4db0-8dc9-b370187451f3))
(pad "19" smd roundrect (at 3.9346 -2.64 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "19" smd roundrect (at 3.9346 -2.64 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 1 "GND") (pinfunction "VSS") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 211bffc6-1db1-4b6c-8404-fa6c19ee003f)) (net 1 "GND") (pinfunction "VSS") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 775e5a3c-5b8f-4ba4-83b7-0536f58ff6d0))
(pad "20" smd roundrect (at 3.9346 -2.16 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "20" smd roundrect (at 3.9346 -2.16 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 48 "Net-(IC1-Pad20)") (pinfunction "PIN_MODE") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 4eb8f846-1bcc-485e-b5c0-474fb44ec651)) (net 48 "Net-(IC1-Pad20)") (pinfunction "PIN_MODE") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 786bd610-9aca-4ef4-ab5b-f774b948ac49))
(pad "21" smd roundrect (at 3.9346 -1.68 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "21" smd roundrect (at 3.9346 -1.68 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 16 "/TEMP_N") (pinfunction "TEMP_N") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 2aa216be-8dcf-4249-afbd-69a7350afe50)) (net 16 "/TEMP_N") (pinfunction "TEMP_N") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp d0989857-e6c5-4067-96f0-87c5643f376d))
(pad "22" smd roundrect (at 3.9346 -1.2 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "22" smd roundrect (at 3.9346 -1.2 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 17 "/TEMP_P") (pinfunction "TEMP_P") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp b17c3765-70d5-41b0-aa9e-7b1d1c3660ad)) (net 17 "/TEMP_P") (pinfunction "TEMP_P") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 9286d311-201d-4cb3-9202-1ac99b03bc4e))
(pad "23" smd roundrect (at 3.9346 -0.72 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "23" smd roundrect (at 3.9346 -0.72 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 49 "unconnected-(IC1-Pad23)") (pinfunction "RF") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp e2667b1f-7844-45a1-9471-044c7f7625d7)) (net 49 "unconnected-(IC1-Pad23)") (pinfunction "RF") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 856ea1d9-07b1-40dd-92bf-1d3eafa9bfdf))
(pad "24" smd roundrect (at 3.9346 -0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "24" smd roundrect (at 3.9346 -0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 50 "unconnected-(IC1-Pad24)") (pinfunction "TF") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 7966a2c5-0041-4a51-90f2-66dd40318882)) (net 50 "unconnected-(IC1-Pad24)") (pinfunction "TF") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp a32a5e22-e0ec-4d73-9ae8-11af7974d11c))
(pad "25" smd roundrect (at 3.9346 0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "25" smd roundrect (at 3.9346 0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 51 "Net-(IC1-Pad25)") (pinfunction "CLKO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 26d01acc-b6c9-43e9-abf1-9ac6e337b63b)) (net 51 "Net-(IC1-Pad25)") (pinfunction "CLKO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 0ddfba65-5669-40c4-9abb-e602296feafa))
(pad "26" smd roundrect (at 3.9346 0.72 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "26" smd roundrect (at 3.9346 0.72 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 52 "Net-(IC1-Pad26)") (pinfunction "CO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 7e2b93a0-c9d7-40da-a360-56f3bd304a2c)) (net 52 "Net-(IC1-Pad26)") (pinfunction "CO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 30ef0cc7-6b50-43d9-a663-d47f94652f8d))
(pad "27" smd roundrect (at 3.9346 1.2 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "27" smd roundrect (at 3.9346 1.2 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 53 "Net-(IC1-Pad27)") (pinfunction "RI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp a2c5f8d4-097f-421c-8496-7c64ce3ae2cf)) (net 53 "Net-(IC1-Pad27)") (pinfunction "RI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 9673c4b9-a268-425e-be92-bfb6af642b33))
(pad "28" smd roundrect (at 3.9346 1.68 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "28" smd roundrect (at 3.9346 1.68 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 54 "Net-(IC1-Pad28)") (pinfunction "NRSTO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp e07293dc-578a-486b-9ae0-8c95c23d9058)) (net 54 "Net-(IC1-Pad28)") (pinfunction "NRSTO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 1f42da21-95de-4449-85ec-e0ce580bed2c))
(pad "29" smd roundrect (at 3.9346 2.16 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "29" smd roundrect (at 3.9346 2.16 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 55 "Net-(IC1-Pad29)") (pinfunction "BO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp e226c6f8-c60e-42d3-9078-1b80425b9232)) (net 55 "Net-(IC1-Pad29)") (pinfunction "BO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 6c942f06-df33-4bf4-9372-99538bf0da55))
(pad "30" smd roundrect (at 3.9346 2.64 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "30" smd roundrect (at 3.9346 2.64 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 31 "Net-(C17-Pad2)") (pinfunction "VDD1_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp a917b769-b325-41ae-bbfa-04cac2965465)) (net 31 "Net-(C17-Pad2)") (pinfunction "VDD1_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp bee9081e-d963-4380-9b49-f926da1d1bcb))
(pad "31" smd roundrect (at 3.9346 3.12 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "31" smd roundrect (at 3.9346 3.12 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 30 "Net-(C15-Pad2)") (pinfunction "VDD2_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 31aa0ed1-585d-4f83-a3c4-55bd767bb6d6)) (net 30 "Net-(C15-Pad2)") (pinfunction "VDD2_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 062d7267-853b-4bcd-a644-b5a577cd9a94))
(pad "32" smd roundrect (at 3.9346 3.6 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5) (pad "32" smd roundrect (at 3.9346 3.6 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(net 29 "Net-(C12-Pad2)") (pinfunction "VDD3_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 5e21c88c-2e0d-4454-a414-a8f880a13b99)) (net 29 "Net-(C12-Pad2)") (pinfunction "VDD3_1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp f5a901b3-e3d5-473a-a350-23e2647b25a3))
(pad "33" smd rect (at 0 3 180) (size 6.3 1.85) (layers "B.Cu" "B.Mask") (pad "33" smd rect (at 0 3 180) (size 6.3 1.85) (layers "B.Cu" "B.Mask")
(net 5 "/VDD") (pinfunction "VDD") (pintype "bidirectional") (solder_mask_margin 0.1016) (zone_connect 2) (tstamp 2a57e297-bab4-4ac4-b117-310a80e4b32a)) (net 5 "/VDD") (pinfunction "VDD") (pintype "bidirectional") (solder_mask_margin 0.1016) (zone_connect 2) (tstamp 58f5afb2-dfd0-4062-b75e-5dbe27e07de9))
(pad "34" smd rect (at 0 -1.2 180) (size 6.3 5.55) (layers "B.Cu" "B.Mask") (pad "34" smd rect (at 0 -1.2 180) (size 6.3 5.55) (layers "B.Cu" "B.Mask")
(net 1 "GND") (pinfunction "VSS_0") (pintype "bidirectional") (solder_mask_margin 0.1016) (zone_connect 2) (tstamp 92a51b4d-011a-41a1-a105-9286e70ec734)) (net 1 "GND") (pinfunction "VSS_0") (pintype "bidirectional") (solder_mask_margin 0.1016) (zone_connect 2) (tstamp c13f82fe-52fd-4051-98df-11249889a8ef))
(model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-44-1EP_8x8mm_P0.65mm_EP6.6x6.6mm.step" (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-44-1EP_8x8mm_P0.65mm_EP6.6x6.6mm.step"
(offset (xyz 0 0 0)) (offset (xyz 0 0 0))
(scale (xyz 1 1 1)) (scale (xyz 1 1 1))

10
bitaxeMax.kicad_sch
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(effects (font (size 1.27 1.27)) hide) (effects (font (size 1.27 1.27)) hide)
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(effects (font (size 1.27 1.27)) hide) (effects (font (size 1.27 1.27)) hide)
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(property "Datasheet" "https://www.jauch.com/downloadfile/5ef1edcfb8e2f73163c8ce8009ef659d1/jo32-1.8-3.3v.pdf" (id 3) (at 40.005 97.155 0) (property "Datasheet" "https://www.jauch.com/downloadfile/5ef1edcfb8e2f73163c8ce8009ef659d1/jo32-1.8-3.3v.pdf" (id 3) (at 40.005 97.155 0)
@@ -4721,7 +4721,7 @@
(reference "H6") (unit 1) (value "MountingHole") (footprint "MountingHole:MountingHole_3.5mm") (reference "H6") (unit 1) (value "MountingHole") (footprint "MountingHole:MountingHole_3.5mm")
) )
(path "/c2c4c89f-d26c-46ad-8ca9-fddab83afb42" (path "/c2c4c89f-d26c-46ad-8ca9-fddab83afb42"
(reference "IC1") (unit 1) (value "BM1397_mode1") (footprint "DayMiner:SON45P800X800X70-33T645X800N") (reference "IC1") (unit 1) (value "BM1397_mode1") (footprint "bitaxe:BM1397")
) )
(path "/070242be-4252-4b22-aa9b-8f7edccbbd89" (path "/070242be-4252-4b22-aa9b-8f7edccbbd89"
(reference "J1") (unit 1) (value "Conn_01x01") (footprint "TPS40305_supply:63862-1") (reference "J1") (unit 1) (value "Conn_01x01") (footprint "TPS40305_supply:63862-1")
@@ -4868,7 +4868,7 @@
(reference "TP19") (unit 1) (value "TestPoint") (footprint "TestPoint:TestPoint_Pad_D1.5mm") (reference "TP19") (unit 1) (value "TestPoint") (footprint "TestPoint:TestPoint_Pad_D1.5mm")
) )
(path "/da2b1d8a-4f67-42b6-82c6-b1b3c8edd2d0" (path "/da2b1d8a-4f67-42b6-82c6-b1b3c8edd2d0"
(reference "U1") (unit 1) (value "oscillator") (footprint "DayMiner:O 25,0-JO32-B-1V3-1-T1-LF") (reference "U1") (unit 1) (value "oscillator") (footprint "bitaxe:O 25,0-JO32-B-1V3-1-T1-LF")
) )
(path "/344ae6a9-1ee5-471b-96c8-2558947378a6" (path "/344ae6a9-1ee5-471b-96c8-2558947378a6"
(reference "U2") (unit 1) (value "SN74LVC1T45QDCKRQ1") (footprint "Package_TO_SOT_SMD:SOT-363_SC-70-6") (reference "U2") (unit 1) (value "SN74LVC1T45QDCKRQ1") (footprint "Package_TO_SOT_SMD:SOT-363_SC-70-6")
@@ -4895,7 +4895,7 @@
(reference "U9") (unit 1) (value "TPS40305") (footprint "TPS40305_supply:TPS40305") (reference "U9") (unit 1) (value "TPS40305") (footprint "TPS40305_supply:TPS40305")
) )
(path "/8ec0a9c6-2b78-44ef-a83d-9047d2828409/3bb37263-3b43-4f43-bba6-c0ec681def98" (path "/8ec0a9c6-2b78-44ef-a83d-9047d2828409/3bb37263-3b43-4f43-bba6-c0ec681def98"
(reference "U10") (unit 1) (value "DS4432U+") (footprint "") (reference "U10") (unit 1) (value "DS4432U+") (footprint "Package_SO:TSSOP-8_3x3mm_P0.65mm")
) )
(path "/ca857324-2ec8-447e-bd58-90d0c2e6b6d7/958db401-f10e-405e-a8bd-b19901d7ace4" (path "/ca857324-2ec8-447e-bd58-90d0c2e6b6d7/958db401-f10e-405e-a8bd-b19901d7ace4"
(reference "U11") (unit 1) (value "MCP1824") (footprint "Package_TO_SOT_SMD:SOT-23-5") (reference "U11") (unit 1) (value "MCP1824") (footprint "Package_TO_SOT_SMD:SOT-23-5")

2
fp-lib-table
View File

@@ -1,5 +1,5 @@
(fp_lib_table (fp_lib_table
(lib (name "DayMiner")(type "KiCad")(uri "${KIPRJMOD}/DayMiner.pretty")(options "")(descr "")) (lib (name "DayMiner")(type "KiCad")(uri "${KIPRJMOD}/DayMiner.pretty")(options "")(descr ""))
(lib (name "TPS40305_supply")(type "KiCad")(uri "${KIPRJMOD}/TPS40305_supply.pretty")(options "")(descr "")) (lib (name "TPS40305_supply")(type "KiCad")(uri "${KIPRJMOD}/TPS40305_supply.pretty")(options "")(descr ""))
(lib (name "BM1397")(type "KiCad")(uri "/Users/skot/Work/Bitcoin/BM1397/cad/BM1397.pretty")(options "")(descr "")) (lib (name "bitaxe")(type "KiCad")(uri "${KIPRJMOD}/bitaxe.pretty")(options "")(descr ""))
) )

10
power.kicad_sch
View File

@@ -1839,10 +1839,16 @@
(uuid 3bb37263-3b43-4f43-bba6-c0ec681def98) (uuid 3bb37263-3b43-4f43-bba6-c0ec681def98)
(property "Reference" "U10" (id 0) (at 220.98 107.315 0)) (property "Reference" "U10" (id 0) (at 220.98 107.315 0))
(property "Value" "DS4432U+" (id 1) (at 225.425 127.635 0)) (property "Value" "DS4432U+" (id 1) (at 225.425 127.635 0))
(property "Footprint" "" (id 2) (at 226.06 117.475 0) (property "Footprint" "Package_SO:TSSOP-8_3x3mm_P0.65mm" (id 2) (at 226.06 117.475 0)
(effects (font (size 1.27 1.27)) hide) (effects (font (size 1.27 1.27)) hide)
) )
(property "Datasheet" "" (id 3) (at 226.06 117.475 0) (property "Datasheet" "https://datasheets.maximintegrated.com/en/ds/DS4432.pdf" (id 3) (at 226.06 117.475 0)
(effects (font (size 1.27 1.27)) hide)
)
(property "DK" "DS4432U+-ND" (id 4) (at 226.06 117.475 0)
(effects (font (size 1.27 1.27)) hide)
)
(property "PARTNO" "DS4432U+" (id 5) (at 226.06 117.475 0)
(effects (font (size 1.27 1.27)) hide) (effects (font (size 1.27 1.27)) hide)
) )
(pin "1" (uuid 4287253f-b116-4a58-a636-dffef7726dd4)) (pin "1" (uuid 4287253f-b116-4a58-a636-dffef7726dd4))