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shrink the power pads for #4 and switched the BM1387 pin pitch to 0.48mm for #5. still need to fix PCB
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(net 59 "Net-(IC1-Pad21)") (pinfunction "ADDR1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 9d7b1104-9c94-4724-94b7-8e146c08c62e))
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(net 60 "Net-(IC1-Pad22)") (pinfunction "ADDR2") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp b760eed3-9072-4382-ae03-a8fd70f59dac))
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(net 28 "Net-(IC1-Pad30)") (pinfunction "BI_A") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 3b98cdf1-cb59-4b3d-bf27-5c751394d753))
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||||
(net 3 "GND") (pinfunction "PLL_VSS") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 0cd628c5-4c50-49e2-a348-9de6f915ab4f))
|
||||
(pad "8" smd roundrect (at -3.9346 0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 9 "/0V8_2") (pinfunction "PLL_VDD") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp f7c8237d-495b-4b29-8ba1-3f21bf9312bd))
|
||||
(pad "9" smd roundrect (at -3.9346 -0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 49 "Net-(IC2-Pad9)") (pinfunction "VDDIO_08") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 0ce15261-7843-46b2-8883-4153608162b7))
|
||||
(pad "10" smd roundrect (at -3.9346 -0.72 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 50 "Net-(IC2-Pad10)") (pinfunction "LDO_08O") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 9609c689-cc1a-4aaa-b5cf-f32ad20273a9))
|
||||
(pad "11" smd roundrect (at -3.9346 -1.2 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 51 "Net-(IC2-Pad11)") (pinfunction "LDO_18I") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 19fd914a-467c-4de2-aba0-07c890cedd91))
|
||||
(pad "12" smd roundrect (at -3.9346 -1.68 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 52 "Net-(IC2-Pad12)") (pinfunction "VDDIO_18") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 395dc1df-aa71-4cc0-9baa-456fab5bdbc6))
|
||||
(pad "13" smd roundrect (at -3.9346 -2.16 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 53 "Net-(IC2-Pad13)") (pinfunction "LDO_18O") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 17c31395-257d-41d0-a3fe-626007c346b5))
|
||||
(pad "14" smd roundrect (at -3.9346 -2.64 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 54 "Net-(IC2-Pad14)") (pinfunction "LDO_25I") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 47216bee-6c1e-4289-92ee-c7be928e7e2b))
|
||||
(pad "15" smd roundrect (at -3.9346 -3.12 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 55 "Net-(IC2-Pad15)") (pinfunction "TEMP_P") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 6e17293e-172b-46d3-b3f8-ded5687816e2))
|
||||
(pad "16" smd roundrect (at -3.9346 -3.6 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 56 "Net-(IC2-Pad16)") (pinfunction "TEMP_N") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 02cb778e-0947-4959-8d20-640ac030c22d))
|
||||
(pad "17" smd roundrect (at 3.9346 -3.6 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 33 "unconnected-(IC2-Pad17)") (pinfunction "RF") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 63d2f05f-e12d-4091-b965-9601f5e88e2a))
|
||||
(pad "18" smd roundrect (at 3.9346 -3.12 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 34 "unconnected-(IC2-Pad18)") (pinfunction "TF") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp a27570b1-5a89-4d93-a167-7666c7f49aa0))
|
||||
(pad "19" smd roundrect (at 3.9346 -2.64 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 3 "GND") (pinfunction "TEST") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 6ca3d6c9-6481-4fd7-ae87-5297d161f8d7))
|
||||
(pad "20" smd roundrect (at 3.9346 -2.16 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 62 "Net-(IC2-Pad20)") (pinfunction "ADDR0") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 472ad9ce-7fdf-4a7a-85e7-4198d035eb9d))
|
||||
(pad "21" smd roundrect (at 3.9346 -1.68 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 63 "Net-(IC2-Pad21)") (pinfunction "ADDR1") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp e7f86f78-283c-4875-9cb9-8c4248d72f65))
|
||||
(pad "22" smd roundrect (at 3.9346 -1.2 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 64 "Net-(IC2-Pad22)") (pinfunction "ADDR2") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp dc82836c-ac0e-43bd-a56b-f798ce5bebb4))
|
||||
(pad "23" smd roundrect (at 3.9346 -0.72 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 65 "Net-(IC2-Pad23)") (pinfunction "ADDR3") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 8e8149e8-a783-4973-a830-14c63c151014))
|
||||
(pad "24" smd roundrect (at 3.9346 -0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 5 "Net-(C11-Pad1)") (pinfunction "XIN") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp d4d69cf3-26c3-4ac4-a102-ca3524958d5b))
|
||||
(pad "25" smd roundrect (at 3.9346 0.24 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 4 "Net-(C8-Pad1)") (pinfunction "XOUT") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp eca01c03-6334-4cac-9d28-c39eca6a3e5a))
|
||||
(pad "26" smd roundrect (at 3.9346 0.72 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 6 "/CI") (pinfunction "CI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 4a5f5fda-8472-40a1-98ef-0ab69c969431))
|
||||
(pad "27" smd roundrect (at 3.9346 1.2 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 35 "Net-(IC2-Pad27)") (pinfunction "CI_A") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 05fe30cb-a87a-4d63-b78f-eefd91612008))
|
||||
(pad "28" smd roundrect (at 3.9346 1.68 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 8 "/RO") (pinfunction "RO") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp a8b712d0-eec8-4abd-bfdf-ab0b8684e8e7))
|
||||
(pad "29" smd roundrect (at 3.9346 2.16 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 36 "Net-(IC2-Pad29)") (pinfunction "BI") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 8726452c-a2fe-4f77-9bc7-f52001e4ce5c))
|
||||
(pad "30" smd roundrect (at 3.9346 2.64 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 37 "Net-(IC2-Pad30)") (pinfunction "BI_A") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp c9bd0c6e-f733-4e90-bc1e-c8f414582d54))
|
||||
(pad "31" smd roundrect (at 3.9346 3.12 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 38 "Net-(IC2-Pad31)") (pinfunction "RST_N") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp a2a632cc-6155-4c7d-a161-7b48a69274bf))
|
||||
(pad "32" smd roundrect (at 3.9346 3.6 180) (size 0.86 0.27) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
||||
(net 39 "Net-(IC2-Pad32)") (pinfunction "NRST_A") (pintype "bidirectional") (solder_mask_margin 0.1016) (tstamp 357538ac-fc49-488d-b7d9-e797399195fa))
|
||||
(pad "33" smd rect (at 0 3 180) (size 6.3 1.85) (layers "B.Cu" "B.Mask")
|
||||
(net 2 "/A") (pinfunction "VDD") (pintype "bidirectional") (solder_mask_margin 0.1016) (zone_connect 2) (tstamp 1ce85ff5-5a86-478f-9884-68829b734816))
|
||||
(pad "34" smd rect (at 0 -1.2 180) (size 6.3 5.55) (layers "B.Cu" "B.Mask")
|
||||
(net 3 "GND") (pinfunction "GND") (pintype "bidirectional") (solder_mask_margin 0.1016) (zone_connect 2) (tstamp b535f653-211f-4068-886b-4999c376193f))
|
||||
(model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-44-1EP_8x8mm_P0.65mm_EP6.6x6.6mm.step"
|
||||
(offset (xyz 0 0 0))
|
||||
(scale (xyz 1 1 1))
|
||||
@ -4624,7 +4624,7 @@
|
||||
(gr_line (start 114.930001 46.14) (end 63.109432 46.139433) (layer "Edge.Cuts") (width 0.1) (tstamp c2ae8d6f-f9c3-41ee-ba45-8466923696e4))
|
||||
(gr_line (start 118.79 103.49) (end 118.790001 50) (layer "Edge.Cuts") (width 0.1) (tstamp de4ef58f-77c2-4439-8bce-16620c56857f))
|
||||
(gr_arc (start 63.109432 107.350568) (mid 60.38 106.22) (end 59.249432 103.490568) (layer "Edge.Cuts") (width 0.1) (tstamp eb393b47-fa93-48cd-8cf6-9dc5ed2289ab))
|
||||
(gr_text "VIN" (at 90.7 49.91 90) (layer "B.SilkS") (tstamp 0d4fd9c9-d622-414d-bbd6-c03b17a2a115)
|
||||
(gr_text "VIN" (at 87.398 49.91 90) (layer "B.SilkS") (tstamp 0d4fd9c9-d622-414d-bbd6-c03b17a2a115)
|
||||
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
|
||||
)
|
||||
(gr_text "RST" (at 82.5675 101.6 90) (layer "B.SilkS") (tstamp 0fc668e8-3f77-4a09-a9ce-36b7d320faf5)
|
||||
@ -4657,7 +4657,7 @@
|
||||
(gr_text "TXO" (at 80.035 101.6 90) (layer "B.SilkS") (tstamp b8e215c8-af8a-44f7-8ec4-7bd511a49b4d)
|
||||
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
|
||||
)
|
||||
(gr_text "GND" (at 88 49.91 90) (layer "B.SilkS") (tstamp e9b1a259-06eb-488c-870f-fa9494ffeaa1)
|
||||
(gr_text "GND" (at 84.825 49.783 90) (layer "B.SilkS") (tstamp e9b1a259-06eb-488c-870f-fa9494ffeaa1)
|
||||
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
|
||||
)
|
||||
(gr_text "+5V" (at 107.38 49.46 90) (layer "B.SilkS") (tstamp efffe65a-3b43-4258-9620-ba786ad51f9f)
|
||||
@ -14690,120 +14690,14 @@
|
||||
(zone (net 1) (net_name "/VIN") (layer "B.Cu") (tstamp e0d0453d-ffea-4657-94f0-ab06bee0d905) (hatch edge 0.508)
|
||||
(connect_pads yes (clearance 0.508))
|
||||
(min_thickness 0.254) (filled_areas_thickness no)
|
||||
(fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
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(xy 86.07 65.56)
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(xy 89.19 54.12)
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||||
(xy 89.17 51.37)
|
||||
(xy 86.106 51.435)
|
||||
(xy 92.46 51.37)
|
||||
)
|
||||
)
|
||||
(filled_polygon
|
||||
(layer "B.Cu")
|
||||
(pts
|
||||
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)
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)
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)
|
||||
)
|
||||
|
Loading…
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Reference in New Issue
Block a user